LUPOY耐热PC/ABS HP-5004---Description: Injection Molding, PC/ABS, General Purpose, High Impact at Low Temperature, High Flow, Heat Resistance
Application: Mobile Phone Housing
CAS: and
Information provided by LG Chemical
PC/ABS HP-5004物性信息：
| 比重 | 1.14 g/cc | 1.14 g/cc | ASTM D792 |
| 处理 | 0.020 | 0.020 | Injection Molding |
| 线性成型收缩率,Flow | 0.0040 - 0.0060 cm/cm @Thickness 3.20 mm | 0.0040 - 0.0060 in/in @Thickness 0.126 in | ASTM D955 |
| 熔体流动速率 | 5.0 g/10 min @Load 2.16 kg, Temperature 250 °C | 5.0 g/10 min @Load 4.76 lb, Temperature 482 °F | ASTM D1238 |
| 洛氏硬度（R 级） | 111 | 111 | ASTM D785 |
| 抗张强度(屈服) | 54.9 MPa @Thickness 3.20 mm | 7970 psi @Thickness 0.126 in | 50mm/min; ASTM D638 |
| 伸长率 (断裂) | 100 % @Thickness 3.20 mm | 100 % @Thickness 0.126 in | 50mm/min; ASTM D638 |
| 弯曲强度 | 88.3 MPa @Thickness 3.20 mm | 12800 psi @Thickness 0.126 in | 10mm/min; ASTM D790 |
| 弯曲模量 | 2.26 GPa @Thickness 3.20 mm | 327 ksi @Thickness 0.126 in | 10mm/min; ASTM D790 |
| 悬壁梁缺口冲击强度 | >= 4.90 J/cm @Thickness 3.20 mm, Temperature -30.0 °C | >= 9.18 ft-lb/in @Thickness 0.126 in, Temperature -22.0 °F | ASTM D256 |
| >= 5.88 J/cm @Thickness 3.20 mm, Temperature 23.0 °C | >= 11.0 ft-lb/in @Thickness 0.126 in, Temperature 73.4 °F | ASTM D256 |
LUPOY® PC+ABS HP5004 >(PC+ABS)<
熔融指数: 5 g/10min
缺口冲击: 60 kJ/m²
加工方式: 注射成型
材料属性: 耐热级
符合规定: UL
材料特性: 高流动性 • 耐低温冲击 • 通用级
材料用途: 手机背壳