一、设备功能
适用于晶硅电池片显裂/隐裂、碎片、黑片、断栅、烧结网纹、污染等缺陷检测。
二、设备特点
红外成像相机，直射式拍摄
多规格组件适配
自动上电
流水信号对接
MES系统对接
三、设备技术参数
一、 E functions
Suitable for the detection of obvious/hidden crack, fragment, black chip, broken grid, sintered mesh, contamination and other defects of crystal silicon cell.
二、e characteristics
Infrared imaging camera, direct shooting
Are suitable for multi-specification components
The fault is automatically powered on
Water signal docking
Are connected to the MES system